Post by account_disabled on Jan 30, 2024 15:38:08 GMT 12
Intel Unveils Alder Lake U and P Series Processors: Ultra-Portable Notebooks in March February 24, 2022by Martin 6 After launching the first 12th Gen Core mobile processors based on Alder Lake-H, the Alder Lake-H family, Intel continues to formalize its mobile product stack this morning. Designed to fill the low-power segment of Intel's products for smaller thin and light notebooks, today the company is launching the 28-watt Alder Lake-P series processors, as well as the 15-watt and 9-watt Alder Lake-U series processors. . Notebooks based on both processor subfamilies will be available in March, where they will compete with rival AMD. Ryzen 6000 Mobile series was recently launched .
Technically, today's announcement from Intel is mostly a drop C Level Executive List in terms of information. The company announced the Alder Lake P and U series alongside the H series chips at CES, although it was a blink-and-you'll-miss-it , as most of Intel's efforts were focused on the more recent H series. But now that the launch of the H series has passed and the first U/P series laptops are hitting the market, Intel is giving its low-power processors their moment in the sun. Along with reiterating the specifications of the U/P series processors, including clock speeds, core counts and integrated GPU configurations, today's announcement also offers some new specific details on the overall platform.
Specifically, we now have confirmation of what I/O options are available for various low-power chip configurations, as well as the number of USB ports and PCIe lanes. Also, Intel is also offering a full update to its Evo design program, which outlines the updated requirements for the Alder Lake Evo notebooks. Original accounts are comfortable Intel typically addresses the ultraportable market with its U series processors, all of which end with the letter U in the product name. Depending on the exact configuration, these processors started with dual 9W units and scaled to 28W quad units. This time, Intel is changing it partly due to the new Hybrid core design. Starting with a low-power 9W processor, Intel classifies it as a U-series processor with two performance cores, eight performance cores and 96 GPUs on silicon. Like the ultra-low-power Tiger Lake processor, this one uses Intel's so-called "BGA Type4" or "UP4" design, which combines both the CPU and chipset in one package.
Technically, today's announcement from Intel is mostly a drop C Level Executive List in terms of information. The company announced the Alder Lake P and U series alongside the H series chips at CES, although it was a blink-and-you'll-miss-it , as most of Intel's efforts were focused on the more recent H series. But now that the launch of the H series has passed and the first U/P series laptops are hitting the market, Intel is giving its low-power processors their moment in the sun. Along with reiterating the specifications of the U/P series processors, including clock speeds, core counts and integrated GPU configurations, today's announcement also offers some new specific details on the overall platform.
Specifically, we now have confirmation of what I/O options are available for various low-power chip configurations, as well as the number of USB ports and PCIe lanes. Also, Intel is also offering a full update to its Evo design program, which outlines the updated requirements for the Alder Lake Evo notebooks. Original accounts are comfortable Intel typically addresses the ultraportable market with its U series processors, all of which end with the letter U in the product name. Depending on the exact configuration, these processors started with dual 9W units and scaled to 28W quad units. This time, Intel is changing it partly due to the new Hybrid core design. Starting with a low-power 9W processor, Intel classifies it as a U-series processor with two performance cores, eight performance cores and 96 GPUs on silicon. Like the ultra-low-power Tiger Lake processor, this one uses Intel's so-called "BGA Type4" or "UP4" design, which combines both the CPU and chipset in one package.